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Wangling F4BM245 DK2.45 Df0.0012 (0.1-12.0mm) Copper Clad Laminate
Brief Introduction
F4BM245 is a PTFE-based fiberglass reinforced copper clad laminate manufactured through precise formulation and controlled processes. It utilizes Electro-Deposited (ED) copper foil and is specifically designed for applications that do not require Passive Intermodulation (PIM) performance specifications. The material offers improved electrical characteristics over standard PTFE materials, providing reliable performance in various RF environments.
Technical Features & Benefits
- Dielectric Constant: 2.45 ±0.05 at 10 GHz, providing consistent electrical performance across batches.
- Low Dielectric Loss at Microwave Frequencies: Df of 0.0012 at 10 GHz, minimizing signal attenuation.
- ED Copper Foil Construction: Suitable for standard RF applications without PIM requirements.
- Good Dimensional Stability: Ensures reliable fabrication and assembly processes.
- Radiation-Resistant Properties: Suitable for aerospace and high-reliability applications.
- Cost-Effective Commercial Solution: Excellent value for high-volume production.
Typical Properties:F4BM 245
| Property |
Test Condition |
Unit |
Value |
| Dielectric Constant (Typical) | 10 GHz | – | 2.45 |
| Dielectric Constant Tolerance | – | – | ±0.05 |
| Dissipation Factor (Typical) | 10 GHz | – | 0.0012 |
| 20 GHz | – | 0.0017 |
| Dielectric Constant Temperature Coefficient | -55°C to 150°C | ppm/°C | -120 |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 |
| Volume Resistivity | Normal state | MΩ·cm | ≥6×10⁶ |
| Surface Resistance | Normal state | MΩ | ≥1×10⁶ |
| Electric Strength (Z-direction) | 5 kW, 500 V/s | kV/mm | >25 |
| Breakdown Voltage (XY-direction) | 5 kW, 500 V/s | kV | >32 |
| Coefficient of Thermal Expansion (XY) | -55°C to 288°C | ppm/°C | 20–25 |
| Coefficient of Thermal Expansion (Z) | -55°C to 288°C | ppm/°C | 187 |
| Thermal Stress | 260°C, 10 s, 3 cycles | – | No delamination |
| Water Absorption | 20±2°C, 24 hours | % | ≤0.08 |
| Density | Room temperature | g/cm³ | 2.22 |
| Long-term Operating Temperature | – | °C | -55 to +260 |
| Thermal Conductivity (Z-direction) | – | W/(m·K) | 0.30 |
| Flammability | – | UL-94 | V-0 |
| Material Composition | – | – | PTFE, fiberglass cloth, ED copper foil |
Application Areas
- Microwave and RF circuits: High-frequency signal processing and transmission.
- Radar systems: Reliable performance in detection and tracking applications.
- General communication equipment: Base stations, transceivers, and antennas.
- Test and measurement devices: Calibration boards and RF test fixtures.
- Industrial microwave applications: Heating, drying, and material processing systems.
Available Configurations
- Copper Foil: ED copper foil only, thickness options: 0.5OZ (0.018mm), 1OZ (0.035mm), 1.5OZ (0.05mm), 2OZ (0.07mm).
- Standard Panel Sizes: 460×610mm, 500×600mm, 850×1200mm, 914×1220mm, 1000×1200mm.
- Thickness Range: 0.1mm to 12.0mm (dielectric or total thickness) with specified tolerances.
- Special Configurations: Available with aluminum or copper base plates for thermal management (F4BM245-AL / F4BM245-CU).
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