Name: Wangling F4BM245 DK2.45 Df0.0012 (0.1-12.0mm) Copper Clad Laminate
Brand: Wangling
SKU: F4BM245-XXXX-XX
Price: 45.00 USD
Availability: InStock

Material:Wangling F4BM245 / PTFE + Fiberglass

MOQ:1 Sheet

Price:15-85 USD/Sheet

Packaging:Anti-static / Protective Packaging

Delivery Period:5-10 working days

Payment Method:T/T, Paypal

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Wangling F4BM245 DK2.45 Df0.0012 (0.1-12.0mm) Copper Clad Laminate

Brief Introduction

F4BM245 is a PTFE-based fiberglass reinforced copper clad laminate manufactured through precise formulation and controlled processes. It utilizes Electro-Deposited (ED) copper foil and is specifically designed for applications that do not require Passive Intermodulation (PIM) performance specifications. The material offers improved electrical characteristics over standard PTFE materials, providing reliable performance in various RF environments.

Technical Features & Benefits

Dielectric Constant: 2.45 ±0.05
Low dielectric loss at microwave frequencies
ED copper foil construction for standard RF applications
Good dimensional stability
Radiation-resistant properties
Cost-effective commercial solution

Wangling F4BM245 Laminate

Typical Properties:F4BM 245

Property	Test Condition	Unit	Value
Dielectric Constant (Typical)	10 GHz	–	2.45
Dielectric Constant Tolerance	–	–	±0.05
Dissipation Factor (Typical)	10 GHz	–	0.0012
	20 GHz	–	0.0017
Dielectric Constant Temperature Coefficient	-55°C to 150°C	ppm/°C	-120
Peel Strength	1 OZ F4BM	N/mm	>1.8
Volume Resistivity	Normal state	MΩ·cm	≥6×10⁶
Surface Resistance	Normal state	MΩ	≥1×10⁶
Electric Strength (Z-direction)	5 kW, 500 V/s	kV/mm	>25
Breakdown Voltage (XY-direction)	5 kW, 500 V/s	kV	>32
Coefficient of Thermal Expansion (XY)	-55°C to 288°C	ppm/°C	20–25
Coefficient of Thermal Expansion (Z)	-55°C to 288°C	ppm/°C	187
Thermal Stress	260°C, 10 s, 3 cycles	–	No delamination
Water Absorption	20±2°C, 24 hours	%	≤0.08
Density	Room temperature	g/cm³	2.22
Long-term Operating Temperature	–	°C	-55 to +260
Thermal Conductivity (Z-direction)	–	W/(m·K)	0.30
Flammability	–	UL-94	V-0
Material Composition	–	–	PTFE, fiberglass cloth, ED copper foil

Application Areas

Microwave and RF circuits
Radar systems
General communication equipment
Test and measurement devices
Industrial microwave applications

Available Configurations

Copper Foil: ED copper foil only

Copper Thickness Options: 0.5OZ (0.018mm), 1OZ (0.035mm), 1.5OZ (0.05mm), 2OZ (0.07mm)

Standard Panel Sizes: 460×610mm, 500×600mm, 850×1200mm, 914×1220mm, 1000×1200mm

Thickness Range: 0.1mm to 12.0mm (dielectric or total thickness)

Special Configurations: Available with aluminum or copper base plates for thermal management (F4BM245-AL / F4BM245-CU)

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